Upfu hwesilicon micro chinhu chisina chepfu, chisina kunaka uye chisina kusvibiswa, chinogadzirwa nequartz yechisikigo (SiO2) kana fused quartz (amorphous SiO2 yequartz yechisikigo mushure mekunyunguduka nekutonhorera zvakanyanya) kuburikidza nekupwanya, kukuya, kuyerera, kunatswa kwemvura, kurapwa kwemvura yakachena uye mamwe maitiro. Ndeapi mashandisirwo eupfu hwesilica? HCMilling (Guilin Hongcheng) ndiye mugadziri wesilicon microchigayo chekukuya cheupfuZvinotevera zvinotsanangura kushandiswa kwesilicon micro powder:

Hunhu hwesilicon micro powder ndeihu: refractive index 1.54-1.55, Mohs hardness about 7, density 2.65g/cm3, melting point 1750 ℃, dielectric constant about 4.6 (1MHz). Mashandiro ayo makuru anosanganisira:

(1) Kudzivirira kwakanaka: nekuda kwekuchena kwakanyanya kweupfu hwesilicon, huwandu husina kuchena, kushanda kwakasimba uye kudzivirira kwakanaka kwemagetsi, chigadzirwa chakaporeswa chine simba rakanaka rekudzivirira uye kuramba arc.

(2) Inogona kuderedza tembiricha yepamusoro-soro ye exothermic ye heat reaction ye epoxy resin, kuderedza linear expansion coefficient uye shrinkage ye heat product, nokudaro ichibvisa kushushikana kwemukati kwe heat product uye kudzivirira kutsemuka.

(3) Kuramba ngura: silicon micro powder haisi nyore kuibata nezvimwe zvinhu, uye haibatike nemakemikari nemaacids akawanda nealkalis. Zvidimbu zvayo zvakafukidzwa zvakaenzana pamusoro pechinhu chacho, zvine simba rekudzivirira ngura.

(4) Kuyera saizi yezvikamu zvine mwero, izvo zvinogona kuderedza uye kubvisa kupwanyika uye kupatsanurwa panguva yekushandiswa; Zvinogona kuwedzera simba rekumanikidzwa uye kudzvanywa kwechigadzirwa chabviswa, kuvandudza kuramba kupera, kuwedzera kupisa kwechigadzirwa chabviswa, uye kuwedzera kunonoka kwemoto.

(5) Upfu hwesilicon hwakabatwa ne silane coupling agent hunokwanisa kunyorova zvakanaka kuma resin akasiyana-siyana, hunoshanda zvakanaka pakunyungudutsa, huri nyore kusanganisa uye hahusanganisike.

(6) Kuwedzerwa kweupfu hwesilica sechinozadza mu organic resin hakungogadzirisi chete hunhu hwechigadzirwa chakacheneswa, asi kunoderedzawo mutengo wechigadzirwa.

Mashandisirwo makuru esilicon powder:

(1) Kushandiswa muCCL: Upfu hweSilicon micro imhando yekuzadza kunoshanda. Inogona kuvandudza insulation, thermal conductivity, thermal stability, acid nealkali resistance (kunze kweHF), abrasion resistance uye fire retardancy yeCCL, kuvandudza kusimba kwekukombama uye dimensional stability yebhodhi, kuderedza thermal expansion rate yebhodhi, uye kuvandudza dielectric constant yeCCL. Panguva imwe chete, silicon micro powder inoshandiswa zvakanyanya muindasitiri ye copper clad laminate nekuda kwezvinhu zvayo zvakawanda uye mutengo wakaderera, izvo zvinogona kuderedza mutengo we copper clad laminate.

(2) Kushandiswa mumidziyo yekubikisa epoxy resin: Seimwe yemidziyo inowanzo shandiswa mumidziyo yekubikisa epoxy resin, silicon micro powder ine basa rakajeka mukuvandudza mamwe maitiro eepoxy resin. Semuenzaniso, kuwedzera active silicon micro powder kumidziyo yekubikisa epoxy resin kunogona kuvandudza zvakanyanya kusimba kwe epoxy resin potting material uye kuderedza viscosity yemidziyo yekubikisa epoxy resin.

(3) Kushandiswa mu epoxy plastic sealant: epoxy molding compound (EMC), inozivikanwawo se epoxy resin molding compound uye epoxy plastic sealant, imhando ye powder molding compound yakasanganiswa ne epoxy resin se matrix resin, high-performance phenolic resin se curing agent, filler senge silicon micro powder, uye zvakasiyana-siyana zvinowedzera. MuEMC, silicon powder ndiyo inonyanya kushandiswa filler, uye chiyero chehuremu hwesilicon powder kune epoxy molding compound i70% ~ 90%.

Maitiro ekugadzira silicon micro powder anowanzo fanana zvichienderana nehunhu hwe raw ore, ore process mineralogy nezvimwe zvinhu uye zvinodiwa nevashandisi kuti vaone mhando yechigadzirwa. Kugadzirwa kwe high-purity superfine silicon powder kunowanikwa nekuwedzera superfine grinding kana grinding classification zvichibva pakugadzirira high-purity jecha. Kusarudzwa kwemidziyo yekugadzirisa kwakakosha zvikuru, kunyanya kusarudzwa kwe superfine grinding uye superfine classification equipment. Kusarudzwa kwe superfine grinding uye superfine classification equipment kuchakanganisa zvakananga kubuda uye mhando yezvigadzirwa zvekupedzisira uye chimiro chezvikamu zveupfu. HCMilling (Guilin Hongcheng), semugadziri wesilicon micro powder grinding mill, HLMX silicon micro powder vertical mill yedu chishandiso chakanakira kugadzira ultra-fine silicon micro powder, ine mabhenefiti akawanda akadai sekukwanisa kukuru, nzvimbo yepamusoro chaiyo, kusvibiswa kwakaderera, nezvimwewo. Sisitimu yekupatsanura yesecondary air separation yakagadzirirwa, uye classifier nefeni zvinodzorwa ne frequency conversion speed regulation, saka poda separation efficiency yakakwira; Single head uye multi head powder concentrators zvinoshandiswa kudzora zvinobudirira fineness yezvigadzirwa zvakapedzwa; Kupfava kwechigadzirwa chapera kunobva pa3 μ M kusvika 22 μ m. Zvigadzirwa zvakasiyana-siyana zvinokwanisa kuwanikwa.

HCM'ssilicon microchigayo chekukuya cheupfuYakapfuura nepakati pemiganhu yemimwe migayo yakaita seyechinyakare yemhepo inoyerera uye migayo inodedera, ine simba rinobuda paawa imwe neimwe re4-40t/h, uye kushandiswa kwesimba kwakaderera zvakanyanya pane kwemichina yakafanana yekugaya. Inoshanda zvakanaka nharaunda uye inochengetedza simba.smaikorofoni yeairikonichigayo chekukuya cheupfuKana muine zvinodiwa, ndapota taurai nesu kuti muwane rumwe ruzivo uye mutipe ruzivo rwekutevera:

Zita rezvinhu zvisina kugadzirwa

Kukora kwechigadzirwa (mesh/μm)

kugona (t/h)